How to Properly Spray Release Agent on APG Molds to Prevent Surface Adhesion in Transformer Production

First, thoroughly clean the mold cavity of dust and residual resin. Spray a high-temperature-resistant dedicated APG release agent (the mold temperature should be maintained at approximately 60°C; avoid spraying on cold molds). Close the mold and heat it to the required process temperature (115–140°C), then open it briefly. After spraying the release agent under high temperature, allow it to volatilize for 1–3 minutes. Insert the transformer core assembly, position and secure it, then re-close and lock the mold before initiating high-pressure epoxy injection. This process ensures smooth, flat surfaces on the finished transformer without adhesion issues.